onsemi’s Treo Platform Selected by Teledyne for Advanced Infrared Imaging Design
onsemi announced that Teledyne Technologies has selected its Treo platform to develop next-generation readout integrated circuit (ROIC) application-specific integrated circuits (ASICs) for infrared imaging systems.
Treo’s ROIC process technology leverages high-density, low-power architecture for mission-critical aerospace, defense, security, and scientific applications.
The Treo platform features a modular architecture and a rich set of IP building blocks that help speed up development and reduce time-to-market, built on an advanced 65nm node.
As the industry’s most advanced analog and mixed-signal platform, Treo can be combined with specialized ROIC modules to meet the demands of infrared focal plane array (FPA) systems.
Author’s summary: onsemi’s Treo platform selected for infrared imaging.